首席代表英文简历表格

在个人简历能够被用人单位所看重的，也就是在个人简历中最有价值的，弹毫无疑问求职者的能力就是其中这一。对用人单位来说在人才的招聘上，希望能够招聘到优秀的、有能力的人才。而人才的能力体现在哪些方面呢?除了专业能力、工作经验之外，及时人才的硬技能了。 因此说，个人简历中的硬技能就是个人实力的一部分。

硬技能可以作为个人实力的一部分，同样也是在求职中的重要优势之一。人们求职的过程中也是竞争的过程，在竞争中必须要靠 自身的实力优势，才能取得竞争的有利地位。相对来说，硬技能的优势要大于软技能。

既然硬技能在求职者中所起到的作用如此大，那么在编写个人简历的时候要如何来写呢?首先要注意的是哪些技能属于硬技能，诸如计算机技能、英语能力这种就是典型硬技能。其次，就是技能与求职职位的相符合性。

Name：fwdqHukou：Residency：ShanghaiWork Experience：Current Salary：Tel：E-mail：Career ObjectiveDesired Industry：Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, CertificationDesired Position：Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist StaffDesired address：Shanghai ,Hongkong ,Beijing ,Taiwan ,MacaoDesired Salary：NegotiableWork Experience2006/06—Present***CompanyIndustry: Electronics/Semiconductor/IC
Intel Flash Engineering Department Individual Contributor
Responsibilities：
I have been working in Intel Flash Assembly & Test Engineering
Department as an Individual Contributor since June of 2006.
Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off:
yield of year 2006 has been dramatically increased than that of year 2005.
yield of all products, consecutively meets the goal.
total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007.
Report Directly to: Department ManagerNumber of Subordinate: 14
Reference: Bao Powel
Achievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield.
Our efforts are paid off:
yield of year 2006 has been dramatically increased than that of year 2005.
yield of all products, consecutively meets the goal.
total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007.2006/01—2006/05Intel(Shanghai) Technology Development Ltd. CompanyIndustry: Electronics/Semiconductor/IC
Intel STTD-China Department Electronics Development Engineer
Responsibilities：
1.I had been working in STTD-China since Jan 2006 to May 2006 as a senior module engineer.
that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time.
Report Directly to: Hopman MarkNumber of Subordinate: 14
Reference: Bao Powel
Reason for Leaving: I was transferred to Intel（Shanghai）Products Ltd. Company due to the internal re-organization in June of 2006.
Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle.2005/05—2006/01Nanyang University of Science & TechnologyIndustry: Electronics/Semiconductor/IC
Electronics & Electrical Engineering Department Research Fellow
Responsibilities：
1.I work in Electronics & Electrical Engineering Department of Nanyang University of Science & Technology as a Research Fellow.
2.I majored at Gate Oxide Reliability Research in the duration.
Report Directly to: Professor Pey Kin Leoh
Subordinate: 3
Reference: Patrick Low
Reason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job.
Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself.Project Experience2008/01—PresentAssembly NPI (New Product Introduction)Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it.
Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress.2007/01—2007/12Marginal Electrical Boards RescueProject Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kind of board and around &2.5 million dollars was saved finally.
Responsibility: Being the team leader, I took the job of data analysis, define each member's role, make program plan, coordinate each team member and follow up the progress.2006/10—2007/05Optimization the current Test Process Order for Flash MemoryProject Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me.
Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and implement.2006/05—2006/12Test Yield of Flash memory ImprovementProject Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen.
Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up.Education and Training 2005/05—2006/01Nanyang University of Science & Technology Microelectronics DoctorateI worked in Nan yang University of Science & Technology as a Research Fellow. I major at Gate oxide Reliability research in the duration.2004/03—2005/03Seoul National University of Korea Microelectronics OthersI had been working in National Physical Lab of Seoul National University in Korea since March of 2004 to March of 2005 as a Post-doctor. Where I unhook the project of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and Technology.2001/03—2004/03Shanghai Institute of Microsystemsand Information Technology，Chinese Academy of Sciences InformationTechnology Doctorate1998/09—2001/03Nanjing University of Science & Technology Material Science and Engineering MasterBeing a master student of this period, I have published one EI paper about Super-fine metal power's electrical characteristics.1993/09—1997/07Nanjing University of Science & Technology Material Science and Engineering Bachelor1997/07—1998/07Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification DepartmentProfessional SkillsLanguage Skills：English: EXCELLENT
Korean:AVERAGEComputer Skills：Technology skilled 96Month
SAPunderstanding 8MonthCertificate：2000/11MCSE
1999/06CET6Self-appraisal7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.